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Apollo Sputter Deposition Systems Stratus Electrodeposition Systems
Reaction Engineering of Through-Chip Via Filling for Wafer-Level 3D Packaging, by D.P. Barkey, J. Callahan, A. Keigler, Z. Liu, A. Ruff, J.. Trezza, and B. Wu, presented at ECTC 2007. Presentation made at ECTC 2007. Pattern Effects on Electroplated Copper Pillars, by A. Keigler, B. Wu, J. Zhang, Z. Liu, presented at IWLPC November 2006. Copper Deposition for Pillars and Vias Semiconductor Manufacturing, August 2006. Active Boundary Layer Thinning in Advanced Packaging Electroplating Semiconductor International, June 2006. Diffusion Boundary Layer Studies in an Industrial Wafer Plating Cell Journal of The Electrochemical Society, 152 (5) (2005) Nimbus Sputter Deposition Systems PVD Processing for Flip Chip: Considering Adhesion Layer Properties by A. Keigler, S. Golovato, K. O'Donnell, J. Chiu, R. Hollman, Advanced Packaging, October 2007. Alternative UBM for Lead Free Solder Bumping using C4NP by K. Ruhmer, E. Laine, K. O'Donnell, J. Kostetsky, K. Hauck, D. Manessis, A. Ostmann, M. Toepper, N. Juergenseen, presented at ECTC 2007. Presentation made at ECTC 2007. Pulsed DC Sputtered Aluminum Nitride: A Novel Approach to Control Stress and C-axis Orientation by P. Soussan, K. O'Donnell, J. D'Haen, G. Vanhoyland, E. Beyne, and H. Tilmans, presented at MRS meeting, Boston, 2004 Under Bump Metallurgy for Lead-free
Solder by Kathy O'Donnell; article in "Lead-free Electronics:
Essential Information on the Lead-free Transition," a supplement
to Advanced Packaging, Connector Specifiier, and SMT
magazines, November 2004 Additional material to above document, presented during Semicon Taiwan September 2004 A Sputtered Nickel
Under Bump Metallurgy Structure for Lead-free Solder for Use in Flip Chip
Packaging by K. O’Donnell, J. Kostetsky, R. DeVito, NEXX Systems;
and V. Bellido-Gonzalez, S. Powell, D. Monaghan, Gencoa; presented at
the Flip Chip Conference 2003 with supplemental presentation materials
Cirrus Systems
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