Sputter Deposition Systems
Apollo Datasheet 7/08
Apollo Multimedia Introduction
Collimated Physical Vapor Deposition for Through-Silicon Via Barrier-Seed Deposition Using Inexpensive Collimators and Scanning Deposition, Production-Worthy Throughput is Achieved, by Stephen Golovato, George Seryogin, and Daniel Goodman, Chip Scale Review, January-February 2010.
Effect of wafer bow on electrostatic chucking and back side gas cooling, by Daniel L. Goodman, Journal of Applied Physics, 104, 124902-1, December 2008
PVD Processing for Flip Chip: Considering Adhesion Layer Properties by A. Keigler, S. Golovato, K. O'Donnell, J. Chiu, R. Hollman, Advanced Packaging, October 2007.
Alternative UBM for Lead Free Solder Bumping using C4NP by K. Ruhmer, E. Laine, K. O'Donnell, J. Kostetsky, K. Hauck, D. Manessis, A. Ostmann, M. Toepper, N. Juergenseen, presented at ECTC 2007. Presentation made at ECTC 2007.
Advances in Metal Deposition for Wafer Bumping by Matt Dorogi, Mark Welsh, and Arthur Keigler, from Advanced Packaging, 2/06 [500k]
Pulsed DC Sputtered Aluminum Nitride: A Novel Approach to Control Stress and C-axis Orientation by P. Soussan, K. O'Donnell, J. D'Haen, G. Vanhoyland, E. Beyne, and H. Tilmans, presented at MRS meeting, Boston, 2004
Under Bump Metallurgy for Lead-free Solder by Kathy O'Donnell; article in "Lead-free Electronics: Essential Information on the Lead-free Transition," a supplement to Advanced Packaging, Connector Specifiier, and SMT magazines, November 2004
Characterization of reaction rates and intermetallic phase formation for Cu, Ni and NiV UBM layers with SnPb and lead-free SnAg solders by K. O'Donnell, NEXX Systems; D. Gupta, APSTL; P. Silberud, Semitool; and C. Lopper, L. Dietrich and M. Toepper, Fraunhofer (IZM); presented at Flip Chip Conference 2004
Additional material to above document, presented during Semicon Taiwan September 2004
A Sputtered Nickel Under Bump Metallurgy Structure for Lead-free Solder for Use in Flip Chip Packaging by K. O’Donnell, J. Kostetsky, R. DeVito, NEXX Systems; and V. Bellido-Gonzalez, S. Powell, D. Monaghan, Gencoa; presented at the Flip Chip Conference 2003 with supplemental presentation materials
Stress Control in NiV, CR and TiW thin Films used in UBM and Backside Metallization by K. O'Donnell, J. Kostetsky, and R.S. Post.