The Apollo
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Higher throughput (50-70 wph)
Lower capital cost per wafer
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Lower target costs/wafer (up to 50%)
Lower cost targets with longer lifetime
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Enhanced vacuum performance
40% reduction in pump-down time
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Still the smallest footprint
50% of cluster tool
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The Nimbus
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Flexible, high performance PVD tool
½ the footprint and ½ the cost of cluster tools
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Thin wafer (100 µm) to thick substrates (2.0 mm)
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Quick wafer size change (90 minutes)
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Low cost sputtering of magnetic materials (nickel)
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