The Apollo
The Apollo, built on the successful architecture of the Nimbus system, advances the state-of-the-art in metal deposition for wafer level packaging due to its remarkable versatility, excellent performance, and low cost of ownership. The Apollo is ideally suited for applications including under bump metallization, redistribution layers, backside metallization, integrated passives, LEDs. In addition, the Apollo is ideally suited for the metallization process required to produce solar panels, a growing application in today's initiatives for alternative energy production.
The Apollo platform offers:
- the lowest capital price, up to $1.0 million less than competitive systems, with the smallest footprint in the industry.
- the highest throughput and the ability to handle wafer sizes 100 mm to 300 mm, ranging in thickness from 100 µm to 2 mm.
- electrostatic chuck (ESC) technology permits the processing of temperature-sensitive substrates, stress control for the processing of thick nickel films and for the backside metallization of thin wafers.
- enhanced deposition chamber pumping affords faster preventive maintenance, a key factor in improved uptime.
The Apollo software affords extremely flexible operation. Incorporating a field-proven, Ethernet-based, distributed control system, the Apollo is able to integrate wafer mapping and alignment at all wafer sizes. MiniBatch software permits the user to process a recipe by batch or by cassette.
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