Electrodeposition
Industry-leading yield at the lowest cost of ownership for pattern plating and TSV applications.
Sputter Deposition
State-of-the-art metal deposition for wafer level packaging applications.
NEXX Systems
NEXX Systems, Inc
Corporate Headquarters
900 Middlesex Turnpike, Bldg. 6
Billerica, MA USA
01821-3929
Phone: +1 978.932.2000 Fax: +1 978.932.2099
Phone: +1 978.932.2000 Fax: +1 978.932.2099
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