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Nimbus :
Flip Chip Advanced Packaging :
Stratus
Electro-deposition :
Cirrus :
ECR :
Publications Library
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Flip Chip Advanced Packaging :
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Nimbus Brochure (PDF)
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Nimbus FAQs
The Nimbus is the only high throughput sputtering system designed specifically for advanced packaging. The Nimbus' innovative architecture enables simultaneous processing of batches of wafers to deposit the multiple layers required for under bump metallization (UBM), backside metallization, redistribution, and integrated passives. The Nimbus combines many of the features and capabilities of the most advanced metal deposition cluster tools with the low cost and simplicity of in-line systems. High throughput, small footprint, and remarkable flexibility make the Nimbus the sputter tool of choice for advanced packaging applications. The Nimbus is available either for automated or manual wafer loading. It uses a common platform for wafer sizes from 50 to 300 mm: the front-end configuration changes, dependent on wafer size. The system's unique wafer handling system enables it to process multiple wafer sizes with minimal hardware changes.
Nimbus Video
(7/03) [15.5 MB] “A
Sputtered Nickel Under Bump Metallurgy Structure for Lead-free Solder
for Use in Flip Chip Packaging,” by K. O’Donnell, J. Kostetsky,
R. DeVito, NEXX Systems; and V. Bellido-Gonzalez, S. Powell, D. Monaghan,
Gencoa; presented at the Flip Chip Conference 2003 with supplemental
presentation materials [1.9 MB] |
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