NEXX Systems : Applications




	Nimbus Video! See Contact-free Bernoulli End Effector in action [15.5 MB Quicktime 5 movie] Quicktime is available at: www.apple.com/quicktime/download/		The Nimbus and Cirrus 80 systems and their core technologies focus on flip chip advanced packaging, including wafer bumping, wafer cleaning, photoresist strip, and related technologies. Flip chip process technology enables extremely compact, high performance electronic systems which are in increasing demand for portable electronics or systems embedded in other products. The Stratus electro-deposition systems are designed specifically for long deposition time processes required in applications such as gold and solder wafer bumping, redistribution layers, and various MEMS layers. The Cirrus 150 and 300 systems offer processing technology targeted to the areas of compound semiconductors, hard disk drive head manufacturing, and ink jet printing. The Cirrus systems are based on ECR (Electron Cyclotron Resonance) plasma technology. Technical papers and NEXX Systems’ product literature can be found in our publications library. Back to top About Us : Products : Applications : News & Events : Service & Support : Contact Us : Home