About NEXX
NEXX Systems, Inc. is a semiconductor equipment company. In contrast to other semiconductor equipment companies, NEXX products are designed expressly for wafer level packaging processing and address the demanding economic and process flexibility requirements of the semiconductor packaging industry.
The Company has two product lines: Stratus, an electrodeposition system offering breakthrough technology that combines the process advantages of vertical wafer orientation with the economic advantages of parallel processing; and Apollo and Nimbus, sputter deposition systems designed to provide high throughput and productivity, with low consumables cost.
3D Packages
3D packages are made up of two or more integrated circuits (chips) stacked vertically to make a single package that occupies less space.
NEXX Systems, unlike other semiconductor equipment companies, has designed its products expressly for wafer level packaging processing; these systems enable our customers to deliver semiconductor devices with greater functionality at a lower cost - a strong value proposition for those participating in the price sensitive consumer electronics market.
Redistribution for WLCSP
As advances in 3D packaging are made, the need rises for patterned, conductive redistribution layers over the surface of the wafer - electroplated wires that are isolated from the wafer except at the connection points. Such redistribution permits higher density, higher performance, and lower cost packages.
The Stratus - due to its wafer capacity and multimetal capability - offers in a single system a highly productive, cost effective solution for both electroplated redistribution layers and the follow-on solder bump steps.
TSVs
A through-silicon via is a vertical electrical connection that passes completely through a silicon wafer or die, replacing edge wiring of more traditional 3D packages. TSVs enable faster communication, lower power consumption, and smaller form factor than traditional packages.
NEXX Systems has taken a leadership role in the development of TSV technology, permitting our customers to develop smaller, faster devices to meet the consumer demand for smart phones, personal digital assistants, and portable music players.
Flip Chip/Bumping
Flip chip process technology enables the extremely compact, high performance electronic systems that are in increasing demand for portable electronics or systems embedded in other products. Connections between the die and carrier are made through conductive bumps placed directly on the die surface, which is then flipped so the bumps connect directly to the carrier.
The Apollo and Nimbus PVD systems are ideally suited for the under bump metallization processing, and the Stratus electrodeposition system for creating solder and gold bumps.
Lead-free/Cu Pillar/Microbumping
Copper pillars offer not only the advantages of improved electrical and thermal performance, but also the reduction or elimination of lead in wafer-level packages. Microbumping is a promising lead-free technique that enables connection of small I/O pitch devices.
Stratus electrodeposits copper into photoresist openings, producing copper pillars that are (1) coplanar (2) have the desired flatness for uniform mechanical loading, and (3) are uniform in height - all critical process parameters.
