Stratus
Electrochemical Deposition System
The Stratus is the leader in advanced wafer-level packaging. A fully automated electrochemical deposition system, the Stratus deposits thick metal layers for wafer bumping, redistribution layers, TSVs, integrated passives, and MEMS.
Apollo
Physical Vapor Deposition System
The Apollo is the most versatile and cost-effective PVD system available. Specifically designed for advanced wafer-level semiconductor packaging it is ideally suited for under bump metallization, redistribution layers, backside metallization, CMOS image sensors, integrated passives, and LEDs.
Click to learn more
NEXX Systems pioneers processes that make today’s electronics smaller and faster by creating more efficient systems for depositing metals on the surfaces of wafers.
NEXX offers innovative products and exceptional customer service, working with clients to customize machine processes to their specific needs. With NEXX, you get the whole package – top-of-the-line machines with the industry’s best support team.
PTI Purchased NEXX Systems Stratus Plating Tool
Download article
International Rectifier Purchases Multiple NEXX Systems PVD Tools for Power Device Manufacturing
Download article
Read our technical paper on Double-Sided Plating
Download article
See NEXX Systems at the IWLPC Conference
Watch video
NEXX Systems secures order from China's Nantong Fujitsu
Download article