NEXX Systems - A Semiconductor Equipment Manufacturer
FEATURED PRODUCTS
Stratus
Electrochemical Deposition System
The Stratus is the leader in advanced wafer-level packaging. A fully automated electrochemical deposition system, the Stratus deposits thick metal layers for wafer bumping, redistribution layers, TSVs, integrated passives, and MEMS.
Apollo
Physical Vapor Deposition System
The Apollo is the most versatile and cost-effective PVD system available. Specifically designed for advanced wafer-level semiconductor packaging it is ideally suited for under bump metallization, redistribution layers, backside metallization, CMOS image sensors, integrated passives, and LEDs.
Click to learn more
WHO WE ARE
TEL NEXX, Inc. pioneers processes that make today’s electronics smaller and faster by creating more efficient systems for depositing metals on the surfaces of wafers.
TEL NEXX, Inc. offers innovative products and exceptional customer service, working with clients to customize machine processes to their specific needs. With TEL NEXX, Inc., you get the whole package – top-of-the-line machines with the industry’s best support team.
WHAT'S NEW
TEL NEXX presents Apollo's NiV PVD Stress Control Capabilities with International Rectifier at the 45th IMAPS Conference
Download article
High Performance LED Manufacturer Purchases TEL NEXX's Apollo PVD Tool
Download article
IBM and TEL NEXX Collaborate to Advance 3D Semiconductor Packaging
Download article
Come visit us at SEMICON West: July 10-12, 2012 in San Francisco: We are in Meeting Room 124 of the North Hall in Moscone Center
Download Directions
NEXX Systems Joins Tokyo Electron as a Wholly Owned Subsidiary
Download article