Nexx Systems

NEXX Systems - A Semiconductor Equipment Manufacturer

FEATURED PRODUCTS

  • Stratus
    Electrochemical Deposition System

    Picture of the Stratus Electrochemical Deposition System

    The Stratus is the leader in advanced wafer-level packaging. A fully automated electrochemical deposition system, the Stratus deposits thick metal layers for wafer bumping, redistribution layers, TSVs, integrated passives, and MEMS.

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  • Apollo
    Physical Vapor Deposition System

    Picture of the Apollo Physical Vapor Deposition System

    The Apollo is the most versatile and cost-effective PVD system available. Specifically designed for advanced wafer-level semiconductor packaging it is ideally suited for under bump metallization, redistribution layers, backside metallization, CMOS image sensors, integrated passives, and LEDs.

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WHO WE ARE

TEL NEXX, Inc. pioneers processes that make today’s electronics smaller and faster by creating more efficient systems for depositing metals on the surfaces of wafers.

Client and NEXX at a meetingTEL NEXX, Inc. offers innovative products and exceptional customer service, working with clients to customize machine processes to their specific needs. With TEL NEXX, Inc., you get the whole package – top-of-the-line machines with the industry’s best support team.

WHAT'S NEW

TEL NEXX presents Apollo's NiV PVD Stress Control Capabilities with International Rectifier at the 45th IMAPS Conference
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High Performance LED Manufacturer Purchases TEL NEXX's Apollo PVD Tool
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IBM and TEL NEXX Collaborate to Advance 3D Semiconductor Packaging
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Come visit us at SEMICON West: July 10-12, 2012 in San Francisco: We are in Meeting Room 124 of the North Hall in Moscone Center
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NEXX Systems Joins Tokyo Electron as a Wholly Owned Subsidiary
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