Nexx Systems

NEXX Systems - A Semiconductor Equipment Manufacturer


  • Stratus
    Electrochemical Deposition System

    Picture of the Stratus Electrochemical Deposition System

    The Stratus is the leader in advanced wafer-level packaging. A fully automated electrochemical deposition system, the Stratus deposits thick metal layers for wafer bumping, redistribution layers, TSVs, integrated passives, and MEMS.

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  • Apollo
    Physical Vapor Deposition System

    Picture of the Apollo Physical Vapor Deposition System

    The Apollo is the most versatile and cost-effective PVD system available. Specifically designed for advanced wafer-level semiconductor packaging it is ideally suited for under bump metallization, redistribution layers, backside metallization, CMOS image sensors, integrated passives, and LEDs.

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TEL NEXX, Inc. pioneers processes that make today’s electronics smaller and faster by creating more efficient systems for depositing metals on the surfaces of wafers.

Client and NEXX at a meetingTEL NEXX, Inc. offers innovative products and exceptional customer service, working with clients to customize machine processes to their specific needs. With TEL NEXX, Inc., you get the whole package – top-of-the-line machines with the industry’s best support team.


TEL NEXX presents Apollo's NiV PVD Stress Control Capabilities with International Rectifier at the 45th IMAPS Conference
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High Performance LED Manufacturer Purchases TEL NEXX's Apollo PVD Tool
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IBM and TEL NEXX Collaborate to Advance 3D Semiconductor Packaging
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Come visit us at SEMICON West: July 10-12, 2012 in San Francisco: We are in Meeting Room 124 of the North Hall in Moscone Center
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NEXX Systems Joins Tokyo Electron as a Wholly Owned Subsidiary
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